3888™ 2-COMPONENT ELECTRICALLY CONDUCTIVE ROOM TEMPERATURE CURE EPOXY; FOR APPLICATIONS THAT REQUIRE A COMBINATION OF GOOD MECHANICAL&ELECTRICAL PROPERTIES; SIZE: 2.5gm TWIN PACK SEALED IN A FLAT BAG; CURE: 24 HRS. @ 23ºC; 1 HR. @ 125ºC; 30 MIN. @ 150ºC

3880™ 1-COMPONENT HEAT CURE EPOXY; SILVER CONDUCTIVE ADHESIVE FOR SOLDER REPLACEMENT; SYRINGE OR STENCIL DISPENSE; SIZE: 5ml SYRINGE; CURE: 10 MIN. @ 125ºC; 6 MIN. @ 150ºC; 3 MIN. @ 175ºC

5421™ ELECTRICALLY CONDUCTIVE RTV SILICONE; PROVIDES EMI/RFI SHIELDING ON ELECTRONIC DEVICE ENCLOSURES; SIZE: 50ml CARTRIDGE; CURE: 24 HR. @ 25ºC; CASE QUANTITY: 1; MINIMUM ORDER: 1

3880™ 1-COMPONENT HEAT CURE EPOXY; SILVER CONDUCTIVE ADHESIVE FOR SOLDER REPLACEMENT; SYRINGE OR STENCIL DISPENSE; SIZE: 10ml SYRINGE; CURE: 10 MIN. @ 125ºC; 6 MIN. @ 150ºC; 3 MIN. @ 175ºC

5421™ ELECTRICALLY CONDUCTIVE RTV SILICONE; PROVIDES EMI/RFI SHIELDING ON ELECTRONIC DEVICE ENCLOSURES; SIZE: 300ml CARTRIDGE; CURE: 24 HR. @ 25ºC; CASE QUANTITY: 1; MINIMUM ORDER: 7

5420™ HEAT CURE ELECTRICALLY CONDUCTIVE SILICONE; PROVIDES A GROUND PATH FOR SENSITIVE ELECTRONIC DEVICES; SIZE: 50 lb. PAIL; CURE: 1 HR. @ 150ºC; CASE QUANTITY: 1

5420™ HEAT CURE ELECTRICALLY CONDUCTIVE SILICONE; PROVIDES A GROUND PATH FOR SENSITIVE ELECTRONIC DEVICES; SIZE: 300ml CARTRIDGE; CURE: 1 HR. @ 150ºC; CASE QUANTITY: 10, MINIMUM ORDER: 90; MADE TO ORDER - 4-5 WEEK LEADTIME