Indium8.9, SAC305 500g jar No-Clean, Type 3, Metal Load = 88.5%
Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium8.9 offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under hightemperature and long reflow processes provides exceptional head-in-pillow performance.
• High transfer efficiency through small apertures (≤0.66 AR)
• Excellent wetting to all common finishes at high and low peak reflow temperatures
• Eliminates head-in-pillow defects
• High oxidation resistance