NC-SMQ92J, Sn63/Pb37 500g jar No-Clean Halogen-Free, Type 3, Metal Load = 90%
NC-SMQ92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.
• Excellent wetting reflow in air
• Probe-testable residue
• Extended open time
• Consistent fine-pitch printing
• Strong initial tack strength and long-term stability
• High humidity resistance