R562 Sn63Pb37 Solder Paste 500g Jar, Water Soluble, Metal % = 90%, Powder Type = T3

  • Manufacturer: Kester
  • Model # 70-2102-0510 (7021020510)
  • Pemro # KES-1106
  • $ 89.82/per jar
  • Available to Order

Minimum order quantity is 10

Must order in multiples of 10

Kester R562 is an organic acid, water-soluble solder paste specifically designed for resistance to environmental extremes. Water-soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. R562 will maintain its print characteristics, tack and activity even after exposure to environmental extremes.

Performance Characteristics:
• Reduces BGA voiding to <3%
• Bright, shiny joints
• 12 hour stencil life
• Print speeds up to 6 in/sec
• Compatible with enclosed print head systems
• Consistent printing over a range of temperatures and humidity
• Capable of multiple reflow profiles before a cleaning operation is required
• Excellent solder-ability to a wide variety of metallizations, including Palladium
• Residues easily removed with hot DI water within 8 hours as best practice after processing
• Classified as ORH0 per J-STD-004
• Capable of off-pad printing with no solderballs after reflow dry out