Indium Solder Paste P/N 800164 (Flux-Indium3.2, Type 3, Water Soluble, Lead-Free, Sn96.5Ag3.0Cu0.5, Metals 0.885). Price and package is in 500g Jars.
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing per formance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding per formance on fine-pitch components, including BGA’s and CSP’s.
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