Indium Solder Paste P/N 800449 (Flux-Indium8.9, Type 3, No-Clean,, Lead-Free, Sn96.5Ag3.0Cu0.5, Metals 0.885). Price and package is in 500g Jars.
Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.
Click here for Datasheet
Click here for MSDS