Indium8.9E, SAC305 500g jar No-Clean, Type 3, Metal Load = 88.75%

  • Manufacturer: Indium
  • Category: Solder Paste
  • Model # 800514-500g
  • Pemro # IND-1091
  • $ 99.96/per jar
  • Available to Order

Minimum order quantity is 7

Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9E offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium8.9E virtually eliminates incomplete coalescence (graping) of small deposits.

Features
• High transfer efficiency through small apertures (≤0.66AR)
• Eliminates graping phenomenon on small deposits
• Low-voiding in BGA/CSP solder joints