Kester Solder Paste P/N 7001020510 (Flux-EP256, Type 3, No-Clean, Sn63Pb37, Metals 0.9). Price and package is in 500g Jars.
Kester Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning. • Stable wetting behavior over a wide range of profiles • Capable of 90 minute break times in printing • High print speeds to 200+ mm/sec (8+ in/sec) • Compatible with enclosed print head systems • Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder • High activity on all substrates, including OSPs • Capable of off-pad printing with no solderballs after reflow • Stencil life: 8+ hours (process dependent) • Scrap is reduced due to less paste dry out • Stable tack over 8+ hours • Classified as ROL0 per J-STD-004 • Compliant to Bellcore GR-78
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